| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0ddb9f3656270bc5410be3679322fead |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-075
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-031
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-037
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0387
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1085
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-12 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-075
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-037
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-031
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 |
| filingDate |
2020-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cddf33a3259cce5391f11ef5917d8c5b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_78470068e2296018d7db5207078792a6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b4608198b5fe67fd762ef715ee6d8a50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0f9d11a173da3db09e2f1438c157362f |
| publicationDate |
2020-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2020196764-A1 |
| titleOfInvention |
Alkali-soluble polyimide and production method thereof, negative-type photosensitive resin composition, cured film, and production method of pattern cured film |
| abstract |
This polyimide resin has a structure represented by general formula (1) and/or a structure represented by a general formula (2). Z in general formula (2) is hydrogen or a monovalent organic group, and X in general formulas (1) and (2) includes the structure represented by general formula (3). R1 in general formula (3) is a divalent organic group, R2 is a tetravalent organic group, and m is an integer greater than or equal to 1. This negative-type photosensitive resin composition contains the aforementioned polyimide, a photopolymerizable compound and a photopolymerization initiator. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022270527-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023021688-A1 |
| priorityDate |
2019-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |