http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020196709-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_962adbf7d50e742218f3d536a63df612 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N10-01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N10-17 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N10-852 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L35-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L35-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L35-16 |
| filingDate | 2020-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_164d3ea35205d1bf1922ae71c05bf4d6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8e15b8d82d25d2e804aae1c74cdd1e96 |
| publicationDate | 2020-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | WO-2020196709-A1 |
| titleOfInvention | Method for manufacturing chip of thermoelectric conversion material |
| abstract | Provided is a method for manufacturing a chip of a thermoelectric conversion material, the method making it possible to perform, in a simple step, annealing of the thermoelectric conversion material in a way that does not involve a junction with an electrode, and making it possible to anneal a thermoelectric semiconductor material at an optimum annealing temperature, the thermoelectric conversion material comprising a thermoelectric semiconductor composition. The method comprises: (A) a step for forming a chip of the thermoelectric conversion material on a substrate; (B) a step for annealing the chip of the thermoelectric conversion material obtained in the step of (A); and (C) a step for peeling the chip of the thermoelectric conversion material after annealing, obtained in the step of (B). The thermoelectric semiconductor composition includes a thermoelectric semiconductor material and a resin, and the temperature of the annealing is not lower than the decomposition temperature of the resin. |
| priorityDate | 2019-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 110.