| abstract |
A pressure sensor and a packaging method thereof. The pressure sensor comprises: a sensitive chip (10), which comprises a thin-wall part (12) and a supporting part (11) connected to the periphery of the thin-wall part, the supporting part (11) being provided with an electrode (14); a sealing element (20), which is fitted over the sensitive chip (10) and partially surrounds together with the sensitive chip (10) to form a sealing cavity (40), the sealing element (20) being provided with a through hole (21) corresponding to the electrode (14); a conductive component (30), which is provided in the through hole (21) in a sealed mode and electrically connected to the electrode (14), the conductive component (30) and the sealing element (20) being arranged in an insulating mode, and the conductive component (30) comprising a filling part (31) and a leading-out part (32) embedded in the filling part (31). By electrically connecting the conductive component (30) to the electrode (14), a lead is not adopted, the packaging size of a pressure sensor is reduced, and absolute pressure packaging is realized. |