| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ad2cd796f8c4dcb425ddcc68707d3444 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-30 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L77-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-544
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-098
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-34 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-098
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L77-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L77-06 |
| filingDate |
2020-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c820ce5db7764a4134fef0c2809d6ec4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_461f9f243b75dda687a5e051e55230ce
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dbca8ab034c51e06b0f4bfbe3e727c85 |
| publicationDate |
2020-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2020189501-A1 |
| titleOfInvention |
Polyamide resin composition |
| abstract |
The present invention is a polyamide resin composition which contains 50-90% by mass of a crystalline polyamide resin (A) and 9-49% by mass of a talc (B), and which is configured such that: the average particle diameter of the secondary particles of the talc (B) in the polyamide resin composition is 30 μm or less; and in the cooling process of the measurement of the polyamide resin composition by means of a differential scanning calorimeter, the exothermic peak is observed on the high temperature side of the maximum exothermic peak of the crystallization temperature during cooling. According to the present invention, variations of the physical characteristics such as molding shrinkage, mechanical characteristics and heat distortion temperature of the polyamide resin composition are suppressed among different production machines or different production lots, and consequently, characteristics within the desired ranges are able to be stably achieved. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022239466-A1 |
| priorityDate |
2019-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |