| abstract |
The invention is directed to a method for adhesively bonding two substrates by means of a moisture-curable adhesive composition, characterized in that at least one of the substrates comprises at least 40 wt.-% of a mixture, said mixture consisting of: - between 15 and 99 wt.-% of at least one thermoplastic polymer, - between 1 and 85 wt.-% of at least one elastomer, and wherein the moisture-curable adhesive composition comprises: - at least one polymer containing silane groups, - between 10 and 40 wt.-% of at least one polymeric plasticizer, - between 0.1 and 5 wt.-% of at least one amino-functional alkoxysilane, - between 0 and 5 wt.-% of at least one C1 – C12-alkyl-functional alkoxysilane. The method yields adhesively bonded substrates without the requirements of using migrating plasticizers and pre-treating of the substrates. |