| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1476752f2420c8f8eb53464cf7fc922b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0026
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0112
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0141
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0129
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4691
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-115 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4688
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0035
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4697
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-036 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate |
2020-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dd899045012a3aa4776e98ceb63a27cd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f6473aed86a6444d9bfbca302afd3ba2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9527546eadc5377d00015ee9ae51373e |
| publicationDate |
2020-08-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2020162473-A1 |
| titleOfInvention |
Resin multilayer substrate and method for producing resin multilayer substrate |
| abstract |
A resin multilayer substrate (101) is provided with: a base material (10A) that is formed in which a plurality of resin layers (11a, 12a) including an open resin layer (resin layer (11a)) are stacked; a conductor pattern (31); and an interlayer connection conductor (V1, V2). The base material (10A) has a recess (D11) formed therein. The open resin layer (resin layer (11a)) is a resin layer which is disposed closer to a first major surface (S1) side than another resin layer (12a). The recess (D11) is composed of a first opening (AP11) formed by performing a cutting process from one surface (VS1) side of the open resin layer, and the other resin layer (12a). The interlayer connection conductor (V1, V2) is formed by filling a second opening, which is formed by performing a cutting process from the other surface (VS2) side of the open resin layer, with a conductor. An edge portion of the first opening (AP11) on the one surface (VS1) side is not in contact with the conductor pattern (31). |
| priorityDate |
2019-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |