| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c19a91365ed494d9fe27d24190d4459f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4673
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4611
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-035
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2201-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0195 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L71-126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F283-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F255-06 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-06 |
| filingDate |
2020-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fd9801fa03d838330d8a1c0d9ddbe127
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_03d8a0fa1bd12d5f1fbf49db7a5d6c45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_52777b735f2c76c94458480a1376e93c |
| publicationDate |
2020-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2020158849-A1 |
| titleOfInvention |
Thermosetting resin composition, resin sheet, laminated plate and printed wiring board |
| abstract |
The present disclosure provides a thermosetting resin composition that, if the thermosetting resin composition or a semi-cured substance thereof is heated, tends to maintain a low melt viscosity state first and then is easily cured in a rapid manner; that is configured such that the preservation stability of the thermosetting resin composition and a semi-cured substance thereof can be improved; and that is configured such that the elevation of the linear expansion coefficient and the decline in the glass transition temperature of the cured product, which could result from the heating, are not likely to occur. The thermosetting resin composition contains a radically polymerizable unsaturated compound and an organic radical compound. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022059625-A1 |
| priorityDate |
2019-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |