| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c0444efde206a2f829562761e58b7e1e |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-045
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-245 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-18 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24 |
| filingDate |
2020-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7c33150b50708c2c6fa15c4de1d2595c |
| publicationDate |
2020-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2020158511-A1 |
| titleOfInvention |
Sheet-shaped prepreg for fan-out package sealing |
| abstract |
The purpose of the present disclosure is to provide: a sheet-shaped prepreg for fan-out package sealing that has both a low coefficient of linear thermal expansion and high flexibility, can form a cured product having excellent warping inhibition and crack resistance, and is unlikely to generate bubbles within the encapsulant when manufacturing reconstructed wafers; a fan-out package; and a method for producing the same. The sheet-shaped prepreg for fan-out package sealing of the present disclosure has a through-hole and/or a recess. In the fan-out package of the present disclosure, a semiconductor chip is sealed by a cured product of the sheet-shaped prepreg for fan-out package sealing. The electronic device of the present disclosure is equipped with the fan-out package of the present disclosure. |
| priorityDate |
2019-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |