| abstract |
An electrolytic copper plate or a copper alloy plating bath, each of which contains at least two types of electrolytes, wherein at least one of nitric acid and a nitrate salt is included in the electrolytes. By using the electrolytic copper plate or the copper alloy plating bath, it becomes possible to form electrodeposits, e.g., a bump electrode group, each having a high aspect at a high speed and in a uniform height or thickness. |