http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020144861-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2038-0016 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2305-076 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B38-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B5-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B37-15 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B38-0012 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B38-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B5-28 |
| filingDate | 2019-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c7becbab4c9c265b973f86932792ae9f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eea8cc36b25db711a756dae138712f8b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e1a61e413ae870907300170e702ade07 |
| publicationDate | 2020-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | WO-2020144861-A1 |
| titleOfInvention | Metal-clad layered plate production method, metal-clad layered plate, printed circuit board and semiconductor package, and coreless base board forming support and semiconductor re-wiring layer forming support |
| abstract | Provided are a metal-clad layered plate having excellent plate thickness accuracy and a production method therefor. In addition, provided are a printed circuit board yielded by forming a circuit on the metal-clad layered plate, and a semiconductor package yielded by mounting a semiconductor element on the printed circuit board. In addition, provided are a coreless baseboard forming support including the metal-clad layered plate, and a semiconductor re-wiring layer forming support. The metal-clad layered plate production method specifically comprises: (1) a step of grinding at least one of the surfaces of a cured product from a prepreg containing a thermosetting resin composition and a base material; and (2-1) a step of layering, on the surface that has been ground in the step (1), a metallic foil to form a metal-clad layered plate, or (2-2) a step of layering, on the surface that has been ground in the step (1), a metallic foil and a thermosetting resin film or a metallic foil-attached thermosetting resin film, in such a manner that the thermosetting resin film is on the ground surface side, to form the metal-clad layered plate. |
| priorityDate | 2019-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 88.