| abstract |
Electrical node (100, 100b, 100c, 200, 200b, 200c, 300, 400, 502, 602, 702, 802, 1404, 404B, 1502, 1504), comprising a substrate (20, 60) for accommodating at least one functional element, preferably an essentially electrical element (12, 14), said substrate having a first side and an opposite second side, said substrate further hosting a number of connecting elements (16, 31) for electrically or electromagnetically, such as inductively, capacitively or optically, connecting the at least one functional element with a circuit of an external structure; the at least one functional element optionally comprising at least one electronic component and further optionally a number of conductive traces connecting thereto, provided to the substrate and optionally projecting from the first side of the substrate; and a first material layer (30) defining a protective covering (10) at least upon said at least one functional element, said first material layer optionally defining at least portion of the exterior surface of the node; wherein the first material layer comprises elastic material arranged to reduce at least thermal expansion and/or mechanical deformation related stresses between one or more elements included in the node, adjacent the node and/or at least at a proximity thereto, preferably between the connecting elements and at least one element of the external structure, such as a material layer (90) molded, cast or otherwise produced or provided on the node. A related multilayer structure and method of manufacture are presented. |