| abstract |
[Problem] To provide a curable silicone composition and a use thereof, the curable silicone composition being capable of molding a cured product, which has a low modulus and is flexible even at high temperatures and has excellent stress relief characteristics, during transfer molding such that warping or defects of the molded product are less likely to occur especially when integrally molded with a base material, wherein the cured product has excellent demolding (mold release) properties after being transfer molded.n[Solution] The present invention provides a curable silicone composition for transfer molding and a use thereof, the curable silicone composition having (1) a maximum torque value of less than 50 dN·m as measured by a moving die rheometer (MDR) at a molding temperature from room temperature to 200°C, and (2) a loss tangent (tanδ) value of less than 0.2 as represented by the ratio of storage torque value/loss torque value when the maximum torque value is reached. |