| abstract |
[Problem] To provide a curable granular silicone composition which has hot-melt properties, and which provides a cured product obtained through overmolding or the like having particularly excellent flexibility and toughness in a temperature range from room temperature to a high temperature of about 150°C, and also provides a cured product that is not easily bent or damaged even when integrally molded with an aluminum lead frame, etc. [Solution] Provided are a curable granular silicone composition and a use thereof, said composition being characterized by comprising: (A) organopolysiloxane resin fine particles having a curing-reactive functional group; (B) a functional inorganic filler; and (C) a curing agent, wherein by using said composition, a cured product is obtained which has a storage elastic modulus of 2000 MPa or less and 100 MPa or less at 25°C and 150°C, respectively, and which has a peak value of tanδ of 0.40 or more as represented by storage elastic modulus/loss elastic modulus (G'/G"). |