http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020138236-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_89afae566b725ae78e20cf972d9bcdc7 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-322 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-2004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0397 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0392 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0045 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-085 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-18 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-039 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 |
| filingDate | 2019-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_164dc69fc7a29d8ef9a68fac4f41772f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dd6b9d0f9c4f086cca5768a6f099a6ac |
| publicationDate | 2020-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | WO-2020138236-A1 |
| titleOfInvention | Chemical amplification positive type photosensitive resin composition, photosensitive dry film, photosensitive dry film manufacturing method, patterned resist film manufacturing method, mold-provided substrate manufacturing method, and plated molded object manufacturing method |
| abstract | Provided are: a chemical amplification positive type photosensitive resin composition that can be used for exposure with h rays and that has excellent plating solution resistance and crack resistance; a photosensitive dry film provided with a photosensitive resin layer comprising the chemical amplification positive type photosensitive resin composition; a photosensitive dry film manufacturing method; a patterned resist film manufacturing method using the chemical amplification positive type photosensitive resin composition; a method for manufacturing a mold-provided substrate by using the chemical amplification positive type photosensitive resin composition; and a plated molded object manufacturing method using the mold-provided substrate. This chemical amplification positive type photosensitive resin composition contains: an acid generator (A) used for producing a mold for forming a plated molded object on a substrate having a metallic surface; and a resin (B) that becomes more soluble to alkali by the effect of an acid, wherein the acid generator (A) contains an acid generator having a specific naphthalimide backbone, and the proportion of the an acrylic resin with respect to the sum of the resin (B) and resins other than the resin (B) is not less than 70 mass%. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2022019637-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022030163-A1 |
| priorityDate | 2018-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 688.