| abstract |
A MEMS packaging structure and a fabrication method therefor, the MEMS packaging structure comprising MEMS chips (210, 220) and a device wafer (100). The MEMS chips (210, 220) are disposed on a first surface (100a) of the device wafer. The MEMS chips (210, 220) have closed microcavities (211, 221) and contact pads (212, 222) for connecting an external electrical signal. A control unit and an interconnection structure (300) electrically connected to both the contact pads (212, 222) and the control unit are provided in the device wafer (100). A rewiring layer (400) electrically connected to the interconnection structure (300) is provided at a second surface (100b) of the device wafer. The fabrication method for the MEMS packaging structure comprises disposing the MEMS chips (210, 220) and the rewiring layer (400) at two sides of the device wafer (100) respectively, which helps to reduce the size of the MEMS packaging structure, and a plurality of MEMS chips having the same or different structures and functions may be integrated on the same device wafer. |