| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a6a73440018eca5d3e92ae110c26dbb1 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-249
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B5-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B5-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 |
| filingDate |
2018-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eb8fc2aec20d98c0669d6c1866f06975
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5dbd5c9061690d5e7777ece3b9d2fe32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1c9a7f5983d691c181ada75f47bc973e |
| publicationDate |
2020-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2020133338-A1 |
| titleOfInvention |
Thermosetting resin composition and prepreg, laminate and high-frequency circuit substrate containing same |
| abstract |
Provided are a thermosetting resin composition and a prepreg, laminate and high-frequency circuit substrate containing same, wherein the thermosetting composition comprises the following components in parts by weight: 0.5-15 parts by weight of an aromatic polycarbodiimide; 30-60 parts by weight of an epoxy resin; 5-30 parts by weight of a hydroxy-containing active ester; and 10-30 parts by weight of a flame retardant. The use of the aromatic polycarbodiimide and hydroxy-containing active ester as co-curing agents for the epoxy resin avoids a step of hydroxy end-capping with an acyl chloride or phenol while ensuring the electrical properties of the finally obtained composition; therefore, the finally obtained curing system has a higher crosslinking density and a good heat and humidity resistance; and furthermore, the aromatic polycarbodiimide has the function of preventing the hydrolysis of ester groups, so that the hydrolysis resistance of the ester-cured epoxy resin can be improved. |
| priorityDate |
2018-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |