| abstract |
Provided in the present invention are a thermosetting resin composition, a prepreg using same, a metal foil-cladded laminate, and a printed circuit board. The thermosetting resin composition comprises an epoxy resin, a phosphorous-containing bisphenol, and an ester curing agent having the structure of formula I. The present invention employs the ester curing agent having the structure of formula I and the phosphorous-containing bisphenol for co-curing of the epoxy resin, uses the phosphorous-containing bisphenol as a primary curing agent, provides a cured substance with great dielectric performance, high temperature resistance, and adhesion, also implements halogen-free flame retardation, combined with the ester curing agent of the structure of formula I, produces no polar groups such as a secondary hydroxyl, and significantly increases the glass transition temperature of the cured substance while ensuring great dielectric performance, and, with the cured substance containing a large amount of hydrophobic groups, significantly reduces the water absorption rate of the cured substance, thus increasing the stability of the dielectric constant and of the dielectric loss factor of the cured substance. The laminate manufactured and the metal foil-cladded laminate have great heat resistance, moisture resistance, peel strength, dielectric performance, and flame retardancy. |