| abstract |
A resin composition, a prepreg used for a printed circuit, and a metal-clad laminate. The resin composition comprises: a silicon-containing arylacetylene resin, a cyanate ester compound, and a maleimide compound. By using the resin composition, the prepared metal-clad laminate may have at least one of characteristics such as a low dielectric loss factor, high heat resistance, and a low coefficient of thermal expansion. |