http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020112710-A1

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filingDate 2019-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2020-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2020112710-A1
titleOfInvention 3d interposer with through glass vias - method of increasing adhesion between copper and glass surfaces and articles therefrom
abstract In some embodiments, a method comprises forming a pilot hole or damage track through a laminate glass structure using a laser. The laminate glass structure comprising a first layer and a second layer adjacent to the first layer. The first layer is formed from a first glass composition. The second layer is formed from a second glass composition different from the first glass composition. After forming the pilot hole, the laminate glass structure is exposed to etching conditions that etch the first glass composition at a first etching rate and the second glass composition at a second etching rate, wherein the first etch rate is different from the second etch rate, to form an etched hole.
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