Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a8a9982b1666c54b5bf02d6c944891e4 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-486 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-15 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-15 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 |
filingDate |
2019-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_72665986be2f8e244b0a72e78409b7cd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7ed0f14fa883833861d1eae385ffc016 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_624b9826f4c968af18a9684db2a690af http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_54d08e6b23400cc54945bd01fbb3dbe9 |
publicationDate |
2020-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
WO-2020112710-A1 |
titleOfInvention |
3d interposer with through glass vias - method of increasing adhesion between copper and glass surfaces and articles therefrom |
abstract |
In some embodiments, a method comprises forming a pilot hole or damage track through a laminate glass structure using a laser. The laminate glass structure comprising a first layer and a second layer adjacent to the first layer. The first layer is formed from a first glass composition. The second layer is formed from a second glass composition different from the first glass composition. After forming the pilot hole, the laminate glass structure is exposed to etching conditions that etch the first glass composition at a first etching rate and the second glass composition at a second etching rate, wherein the first etch rate is different from the second etch rate, to form an etched hole. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022103749-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022055671-A1 |
priorityDate |
2018-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |