| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68318
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68354
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-98
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2919 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-568
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-98 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683 |
| filingDate |
2019-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d457467290dcdd6bdb2fdf71516c2691
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ee1f6ebd8885d1e333f3fac1db482ba4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ca0c3664395756e233ebb86de229f04f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3dc77d279af7111f328513cc9a13a785
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f21e5cb7b3bcea5de5ef92fab2ab3ba1 |
| publicationDate |
2020-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2020111154-A1 |
| titleOfInvention |
Semiconductor device production method and laminate film for temporary fixation material |
| abstract |
Disclosed is a semiconductor device production method comprising: a preparatory step for preparing a laminate in which a supporting member, a temporary fixation material layer that generates heat upon absorption of light, and a semiconductor member are laminated in this order; and a separation step for separating the semiconductor member from the supporting member by irradiating the temporary fixation material layer of the laminate with light. In this production method, the temporary fixation material layer has a light-absorbing layer that generates heat upon absorption of light and a resin cured product layer comprising a cured product of a curable resin component; the curable resin component comprises a hydrocarbon resin; and the cured product of the curable resin component has a storage elastic modulus of 5-100 MPa at 25°C. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022071150-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022186372-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7243934-B2 |
| priorityDate |
2018-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |