| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7e71e94dd7afa6aab21e52b6d5a18b9f |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H7-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01F17-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G4-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-15
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01F27-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G9-15
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H03H7-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01F17-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01F27-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-40 |
| filingDate |
2019-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_81724744c1274d30104891c72235f812
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5c2fff6e4bd4878ac2f848054c863327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_06b9af071fec9e8c38501768502163a0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_07d443931ecbb19f005c8ae2708cf888
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_18f75569835f9a719b710967eb2fb379
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_427d7ce6edffcef84feb288b3be32817 |
| publicationDate |
2020-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2020111137-A1 |
| titleOfInvention |
Electronic component and method of manufacturing same |
| abstract |
An object of the technology of the present disclosure is, for example, to reduce an installation area of an electronic component and reduce a wiring load of the electronic component. An electronic component (2) comprises: a magnetic body (4) that has a hollow part (13); a conductor (6) that penetrates the hollow part of the magnetic body and protrudes from the hollow part; a dielectric layer (14) that is formed on the surface of the conductor; a solid-state electrolytic layer (precoat layer 16-1, solid-state electrolytic layer 16-2) that is formed on the surface of the dielectric layer; and a leading layer (carbon layer 16-3, silver layer 16-4) that is electrically connected to the solid-state electrolytic layer. |
| priorityDate |
2018-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |