http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020110671-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eedd2a00c4d0ba56ecf05fb4b97592dd |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-031 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-037 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-14 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-031 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-037 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| filingDate | 2019-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b4d596d86577182a20542357bc8211e0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e5f27808cdbccbc0fc0bc792074374c2 |
| publicationDate | 2020-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | WO-2020110671-A1 |
| titleOfInvention | Photosensitive thermosetting resin composition, dry film, and printed wiring board |
| abstract | Provided are: a photosensitive thermosetting resin composition that can be developed using a weak-alkaline aqueous sodium carbonate solution, and has excellent photosensitivity, and excellent mechanical properties, such as heat resistance and flexibility; a dry film; and a printed wiring board. This photosensitive thermosetting resin composition is characterized by containing (A) an alkali-soluble polyamide imide resin, (B) a resin having an unsaturated double bond and a carboxyl group, (C) a thermosetting cyclic ether group-containing compound, and (D) a photopolymerization initiator, wherein the alkali-soluble polyamide imide resin (A) has a structure represented by general formula (1) and a structure represented by general formula (2) (X1 represents a residue of a dimer acid-derived aliphatic diamine (a) having 24-48 carbon atoms, X2 represents a residue of an aromatic diamine (b) having a carboxyl group, and each occurrence of Y independently represents a cyclohexane ring or an aromatic ring). |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022210415-A1 |
| priorityDate | 2018-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 158.