| abstract |
Provided are: an epoxy resin composition including an epoxy resin (A), a curing agent (B) that includes a compound represented by formula (B-1) [in the formula, R1 represents a hydrogen atom, a halogen atom, a methoxy group, or a C1-12 hydrocarbon group], and an imidazole-adduct-type curing accelerator (C), wherein the molar ratio of the phenolic hydroxyl group content to the epoxy group content in the epoxy resin composition is 0.25-0.67; and a cured product of the epoxy resin composition. |