| abstract |
The purpose of the present invention is to provide a random copolymer compound and a terminal-modified polymer compound having high heat resistance and adhesiveness while having exceptional film formation capabilities, and having a low dielectric constant and dielectric loss tangent. Specifically, disclosed is a random copolymer compound of (A) a polyphenylene ether resin having phenolic hydroxyl groups at both ends, (B) an aliphatic polymer having alcoholic hydroxyl groups at both ends, and (C) an acid dichloride compound that is a binder, wherein the number of mol a of the (A) polyphenylene ether resin, the number of mol b of the (B) aliphatic polymer, and the number of mol c of the (C) acid dichloride compound that is a binder satisfies the relationship (a + b) > c. |