| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-2227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-001 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-5419
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K5-14 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-5415 |
| filingDate |
2019-08-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_05cccdeec0770e8f9ff2f1d152040284
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_40e74dd31d77fad0d2f0f837fdccc44b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5c4711a261de4a0e52731ed73bb3607a |
| publicationDate |
2020-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2020084860-A1 |
| titleOfInvention |
Thermally conductive silicone composition and cured product thereof |
| abstract |
The present invention is a thermally conductive silicone composition which contains: (A) 100 parts by mass of an organopolysiloxane having at least two alkenyl groups per molecule; (B) an organohydrogenpolysiloxane having at least two hydrogen atoms directly bonded to a silicon atom, at a quantity such that the number of moles of hydrogen atoms directly bonded to a silicon atom is 0.1-5.0 times the number of moles of alkenyl groups derived from component (A); (C) 2800-4000 parts by mass of a thermally conductive filler containing 50 mass% or more of a mixture comprising 25-35 mass% of aluminum hydroxide having an average particle diameter of not less than 0.1 μm and less than 40 μm and 65-75 mass% of aluminum hydroxide having an average particle diameter of 40-100 μm; and (D) a platinum group metal-based curing catalyst, at a quantity of 0.1-1000 ppm in terms of mass of a platinum group metal element relative to component (A). Provided by this configuration are: a thermally conductive silicone composition that gives a thermally conductive silicone cured product that is thermally conductive and lightweight; and a cured product of the thermally conductive silicone composition. |
| priorityDate |
2018-10-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |