http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020080437-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6c8d4dc7bd1a30d8fda907fceaeb4e69 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01B39-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C01B39-04 |
| filingDate | 2019-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1b47903c523fd447cef89479bf74ee15 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ce4e4d112582c8ff9c23630751af3f61 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8adf261d9918e314ce0a3b61bc4d298c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9073fc6311a36b29224954a3c5b05047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6ffc680c62a0ee3db6fb015911c11e46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_83f36fa707385aa19784c397810da6cc http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_70fdb5d2e267273a817d570fa55223d4 |
| publicationDate | 2020-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | WO-2020080437-A1 |
| titleOfInvention | Liquid composition, resin composite, liquid sealing material, sealing material, and electronic device |
| abstract | The first problem to be addressed by the present invention is to provide: a resin composite in which it is possible to reduce the coefficient of thermal expansion while retaining flexibility (i.e., keeping storage elastic modulus at a low level); and a liquid composition from which said resin composite can be obtained. In particular, the present invention addresses a second problem of providing: a resin composite that exhibits a high CTE at low temperatures and a low CTE at high temperatures; and a liquid composition from which said resin composite can be obtained. The present invention addresses a third problem of providing: a resin composite that exhibits excellent tensile characteristics; and a liquid composition from which said resin composite can be obtained. The present invention addresses a fourth problem of providing: a resin composite that exhibits high adhesive power in a state of being in contact with a metal member; and a liquid composition from which said resin composite can be obtained. Further, the present invention addresses a fifth problem of providing: a resin composite that can be suitably used as a sealing material for electronic devices and the like, and that, even when used for a power device, is unlikely to develop distortion or cracks; and a liquid composition from which said resin composite can be obtained. This liquid composition comprises zeolite and an epoxy resin precursor, wherein: the zeolite has an average primary particle diameter of 15-1,000 nm; the zeolite content is 1-50 mass%; and, when cured until a gel fraction of at least 80% is reached, a cured material of the liquid composition, as measured at 100°C, has a storage elastic modulus of 1-1,000 MPa. This zeolite-containing epoxy resin composite comprises zeolite and an epoxy resin, wherein: the zeolite has an average primary particle diameter of 15-1,000 nm; the zeolite content is 1-50 mass%; and the resin composite has a storage elastic modulus of 1-1,000 MPa at 100°C. |
| priorityDate | 2018-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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