| abstract |
A curable resin composition containing a polyether polyol resin that has an epoxy equivalent of 7,000-100,000 g/Eq and is represented by general formula (1), a trifunctional or higher epoxy resin, and an epoxy resin curing agent. Provided is a curable resin composition having exceptional heat resistance as well as exceptional, well-balanced bending resistance, the curable resin composition being applicable to various fields which require heat resistance and toughness, especially the electrical and electronics fields. n is an integer of 1 or higher. A 1 and A 2 are divalent organic groups having an aromatic structure and/or alicyclic structure. B is a hydrogen atom or a glycidyl group. |