http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020080206-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8205ec6ee1cd95eb60a03826535bad97 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-12 |
| filingDate | 2019-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0790d013218abfcc044af374604f8282 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a1ea6e2067d6b18b167980a90d4255b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2a580db05ecb182dae46e81b0f562d39 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b946eab539dd527dc8c7219008be788c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_151c69e12a3868e0c9a67b4d471190a4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b794f475fa06ec96725954041b9416f5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_503d83e4c3216ecc3a7c742867317f00 |
| publicationDate | 2020-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | WO-2020080206-A1 |
| titleOfInvention | Polyamic acid ester resin composition |
| abstract | The present invention provides: a photosensitive resin composition which enables the achievement of a cured product having low dielectric constant and low dielectric loss tangent; a method for producing a substrate with a cured relief pattern using this photosensitive resin composition; and a semiconductor device which is provided with this cured relief pattern. A polyamic acid ester resin composition which contains (A) a polyimide precursor that has a unit structure represented by general formula (1) (wherein X1 represents a tetravalent organic group; Y1 represents a divalent organic group; and each of R1 and R2 independently represents a monovalent organic group), and (B) a carboxylic acid compound represented by general formula (30) (wherein each of Z1 and Z2 independently represents a hydrogen atom, an alkyl group or the like, and Z1 and Z2 may combine with each other to form a ring; in cases where the ring is an aromatic ring, <u></u> indicates a conjugated double bond that has HOOC at the ortho position of COOH; and in cases other than the cases where the ring is an aromatic ring, <u></u> indicates a cis-type double bond with respect to HOOC and COOH) or an anhydride of the carboxylic acid compound, while optionally containing (P) a polymer compound other than the polyimide precursor (A). With respect to this polyamic acid ester resin composition, the carboxylic acid compound or an anhydride thereof (B) may be chemically bonded to the polyimide precursor (A) and/or the polymer compound (P) other than the polyimide precursor (A) via Z1 or Z2. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022210466-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022153967-A1 |
| priorityDate | 2018-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 533.