abstract |
Provided is a resin composition suitable for an insulation adhesive layer for an aluminum-based substrate. This resin composition is heat-resistant and adhesive and, once cured, has a low elasticity in a low temperature range that is 0°C or less. The resin composition includes (A) a modified elastomer having an acid anhydride group, (B) a solvent-soluble polyimide resin, and (C) an epoxy resin. |