| abstract |
The present invention relates to a heat-curable composition comprising at least one epoxy monomer having two or three epoxy groups, which is not a silicon compound having at least one hydrolyzable group directly linked to the silicon atom, at least one epoxy compound bearing at least one silicon atom having at least one hydrolyzable group directly linked to the silicon atom and at least one group comprising an epoxy function linked to the silicon atom though a carbon atom, and/or a hydrolyzate thereof, at least one epoxy ring-opening catalyst, and at least one compound comprising at least two (2,2,6,6-tetramethyl-4-piperidyl)-groups in which the nitrogen atom can be substituted with an alkyl group, an alkoxy group or an oxyl group. |