| abstract |
The present disclosure provides an adhesive composition which contains an epoxy resin, an acrylic resin that is compatibilized with the epoxy resin, a curing agent and a foaming agent. This adhesive composition contains, as the epoxy resin, a first epoxy resin which has a softening temperature of 50°C or higher and an epoxy equivalent of 5,000 g/eq or less, and a second epoxy resin which has a softening temperature higher than the softening temperature of the first epoxy resin, while having a weight average molecular weight of 20,000 or more; and the acrylic resin has a weight average molecular weight of 50,000 or more. |