| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-31 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate |
2019-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a0c9ad41c4ecf8ff58ab639faaa253db
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_40ef09216e33c6cd64ab73f787f5672c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8533abed71c43b125ae636449528a07e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_25b83ca4cecc89e5c9671ff7a657ec6c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b3fd866b4cfe6b9e83650e7f86abb56a |
| publicationDate |
2020-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2020067016-A1 |
| titleOfInvention |
Sealing resin composition, electronic component device, and manufacturing method of electronic component device |
| abstract |
Provided is a sealing resin composition containing: an epoxy resin; a curing agent including an active ester compound; and an inorganic filler including alumina. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021210384-A1 |
| priorityDate |
2018-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |