| abstract |
In an embodiment, provided is a polishing liquid composition capable of improving the abrasion rate of a silicon oxide film. In an embodiment, the present disclosure pertains to a polishing liquid composition that is for a silicon oxide film and that comprises cerium oxide particles (component A), an additive (component B), and an aqueous medium, wherein component B has a reduction potential of 0.45 V or more as measured by cyclic voltammetry (with reference to a Ag/AgCl electrode) in a 10 ppm aqueous solution thereof. |