| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fcc0b66123940d1b32783569ebfa2d45 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F2-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F2-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F2-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-031
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-031
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-44 |
| filingDate |
2019-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_622507fb3980ef7d0a3e6f47a06f1d7a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_faba893318dcdb0cd5f1a3961c35ae8c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8cad4dd50e8a9331f4a4f4e1fea8f019
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_abb2851314d987b0a4e5d0b5e79cfa6d |
| publicationDate |
2020-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2020066633-A1 |
| titleOfInvention |
Photosensitive resin composition, method for forming resist pattern, and method for manufacturing plated shaped body |
| abstract |
The present invention is a photosensitive resin composition characterized by containing a polymerizable compound (A), a light radical polymerization initiator (B), a thiol compound (C), and a polymerization inhibitor (D), the content of the thiol compound (C) being 5-50 mass parts to 100 mass parts of the polymerizable compound (A), and the content of the polymerization inhibitor (D) being 1-10 mass parts to 100 mass parts of the polymerizable compound (A). The present invention makes it possible to provide a photosensitive resin composition having wide exposure latitude (EL) in both bright fields and dark fields. Using the photosensitive resin composition, it is possible to provide a method for forming a resist pattern with which it is possible to form a fine resist pattern having good accuracy in both bright fields and dark fields. Using a resist pattern formed using the method for forming a resist pattern, it is possible to provide a method for manufacturing a plated shaped body with which it is possible to manufacture a fine plated shaped body having good accuracy. |
| priorityDate |
2018-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |