http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020059572-A1

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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301
filingDate 2019-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5318360782c67da3dda81e330d9e20e4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ce64f40a16dafb100055918b959be5c8
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publicationDate 2020-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2020059572-A1
titleOfInvention Method for manufacturing electronic device
abstract A method for manufacturing an electronic device according to the present invention includes in the following order: a step (A) for preparing a structure (60) including a half-diced electronic component (10) having a circuit forming surface (10A), and an adhesive laminate film (50) which has a base layer and an adhesive resin layer (40), the adhesive resin layer (40) side adhered on the circuit forming surface (10A) of the electronic component (10) so as to protect the circuit forming surface (10A); a step (B) for back-grinding the opposite surface to the circuit forming surface (10A) of the electronic component (10); a step (C) for performing a full-dicing on the electronic component (10); and a step (D) for forming an electromagnetic wave shielding layer (70) on the segmented pieces of the electronic component (10), wherein, in the step (A), the step (B), the step (C), and the step (D), the same adhesive laminate film is used as the adhesive laminate film (50).
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021235389-A1
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priorityDate 2018-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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