| abstract |
The present invention relates to one-component thermosetting epoxy resin compositions that are particularly suitable for the bonding of substrates having different coefficients of thermal expansion, especially in the construction of shells of modes of transport or white goods. The one-component thermosetting epoxy resin composition comprises a) at least one epoxy resin A having an average of more than one epoxy group per molecule; b) at least one 2,4-diamino-1,3,5-triazine containing, in the 6 position, - an alkyl radical having 1 to 20 carbon atoms in which a hydrogen atom in the α position has optionally been replaced by a 2,4-diamino-1,3,5-triazin-6-yl radical, - a cycloalkyl radical having 5 to 12 carbon atoms or - an aryl radical having 6 to 12 carbon atoms; and c) at least one toughness improver D which is a terminally blocked polyurethane polymer D1. |