| abstract |
The present invention addresses the problem of providing a photosensitive resin composition which has good pattern processability and can be cured at a low temperature into a cured film having high chemical resistance, high elasticity, high elongation and high adhesiveness to a metal, particularly copper. The present invention is a photosensitive resin composition comprising (A) at least one resin selected from the group consisting of an epoxy resin, polyimide, a polyimide precursor, polybenzoxazole, a polybenzoxazole precursor and polysiloxane, (B) a thermal base generator, and (C) a photosensitizer, wherein the thermal base generator (B) comprises at least one component selected from a guanidine derivative and a biguanide derivative, and the photosensitizer (C) comprises (c-1) a photo-acid generator and/or (c-2) a photo-radical polymerization initiator. |