| abstract |
The present invention addresses the problem of providing: a copper-clad laminate which is suppressed in the occurrence of a blister; a method for producing this copper-clad laminate; and a printed wiring board and a semiconductor package, each of which uses this copper-clad laminate. The present invention relates to: a copper-clad laminate which comprises an insulating layer that contains a resin and a copper foil that is arranged on at least one surface of the insulating layer, and which is configured such that the copper foil is a surface-treated copper foil that has a metal treatment layer containing zinc, and the amount of zinc in the metal treatment layer is 10-2,500 μ/dm 2 ; a method for producing this copper-clad laminate; and a printed wiring board and a semiconductor package, each of which uses this copper-clad laminate. |