| abstract |
An organic substrate according to the present disclosure contains a resin component which contains, as a main component, at least one resin that is selected from the group consisting of an epoxy resin, a polyimide resin, a phenolic resin, an amino resin, a polyester resin, a polyphenylene resin, a cyclic olefin resin and a Teflon (registered trademark) resin, and a non-resin component which contains at least one of an inorganic filler and a flame retardant; the non-resin component is dispersed in the resin component; at least some of the non-resin component aggregates, thereby forming aggregates 1; some of the resin component forms resin material parts 2, which are in the form of particles; the resin material parts 2 are present within the aggregates 1, or alternatively, the resin component forms a matrix that surrounds the aggregates 1; and voids are present at some interfaces between the resin component and the aggregates 1. |