| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3239ac6dd2f8d345586118a7ca507ada |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-095 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H9-02086
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N30-875
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N30-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N30-883
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H9-02913
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H9-1014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H9-1071
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N30-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H3-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00 |
| filingDate |
2019-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c1f393df88fa6d6aa84785367e8ac4a6 |
| publicationDate |
2019-12-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2019233667-A1 |
| titleOfInvention |
Wafer level package and method of manufacture |
| abstract |
A wafer level package comprises a functional wafer with a first surface, device structures connected to device pads arranged on the first surface. A cap wafer, having an inner and an outer surface, is bonded with the inner surface to the first surface of the functional wafer. A frame structure surrounding the device structures is arranged between functional wafer and cap wafer. Connection posts are connecting the device pads on the first surface to inner cap pads on the inner surface. Electrically conducting vias are guided through the cap wafer connecting inner cap pads on the inner surface and package pads on the outer surface of the cap wafer. |
| priorityDate |
2018-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |