http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019225482-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L25-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-42 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L25-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| filingDate | 2019-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9cb8b7eb8cc4e438713641a36711b775 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d912ab6c882d3c3007a3e95ff4c29811 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5ebee93f7fa02f183efb35b4c6282f59 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f1587583a3f67769644b1d0359fa4d3f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1dc1c0e567754407f8b4ccae99944006 |
| publicationDate | 2019-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | WO-2019225482-A1 |
| titleOfInvention | Resin varnish, prepreg, laminate, printed wiring board, and semiconductor package |
| abstract | Provided is a resin varnish having high heat resistance, low relative permittivity, high metal foil adhesion, high glass transition temperature, and low thermal expansion properties, excellent moldability and plating uniformity, and also minimal fluctuation in the amount of dimensional variation. Also provided are a prepreg, a laminate, a printed wiring board, and a semiconductor package obtained using the resin varnish. The resin varnish comprises (A) a maleimide compound, (B) an epoxy resin, and (C) a copolymer resin having structural units derived from an aromatic vinyl compound and structural units derived from maleic anhydride, the maleimide compound (A) being a maleimide compound having an N-substituted maleimide group, obtained by reacting (a1) a maleimide compound having at least two N-substituted maleimide groups, (a2) a monoamine compound, and (a3) a diamine compound, and being obtained by reaction in which the usage ratio [(a2) component/(a3) component] (mole ratio) of the (a2) component to the (a3) component is 0.9-5.0. |
| priorityDate | 2018-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 295.