| abstract |
The purpose of the present invention is to provide an active ester compound which can be used in a curable resin composition having excellent heat resistance and dielectric characteristics. The purpose of the present invention is also to provide a curable resin composition including the active ester compound, an adhesive obtained using the curable resin composition, an adhesive film, a circuit substrate, an interlayer insulation material, and a multilayer printed wiring board. The present invention is an active ester compound having a structure represented by formulas (1-1) through (1-3) or formulas (2-1) through (2-3). In formulas (1-1) and (1-2), R1 is an aromatic group which may be substituted. In formula (1-3), R2 is a C1-12 alkyl group or an aromatic group which may be substituted. In formula (1-1), A is an aliphatic dicarboxylic acid residue. In formulas (1-2) and (1-3), B is an aliphatic diamine residue. In formulas (2-1) and (2-2), R1 is an aromatic group which may be substituted. In formula (2-3), R2 is a C1-12 alkyl group or an aromatic group which may be substituted. In formula (2-1), A is an aliphatic tricarboxylic acid residue. In formulas (2-2) and (2-3), B is an aliphatic triamine residue. |