| abstract |
The present invention is a curable composition including an epoxy compound (A), a curing agent (B) which is liquid at 23°C, an inorganic filler (C) which has a thermal conductivity of 10 W/m∙K or greater and is spherical, and an ion exchanger (X), the ion exchanger (X) comprising a zirconium-based cation exchanger and a bismuth-based anion exchanger. Through the present invention, it is possible to provide a curable composition having excellent heat dissipation properties, insulating reliability, and application properties. |