| abstract |
The present invention provides: an insulation sheet that includes resin composition layers (14, 24, 34), the relative dielectric constant at a frequency of 1 MHz of one surface side (14X, 24X, 34X) being higher than the relative dielectric constant of the other surface side (14Y, 24Y, 34Y), and a circuit pattern being formed on the one surface side; laminates (10, 20, 30) in which the insulation sheet and metal plates (12, 22, 32) are included in the stated order on metal base plates (16, 26, 36), a circuit pattern being formed on the metal plates; and a substrate in which the insulation sheet and the metal plates are included in the stated order on the metal base plates, the metal plates having a circuit pattern. |