| abstract |
The purpose of the present invention is to provide a terminal-modified polymer compound and a random copolymer compound which has high heat resistance and adhesion while having excellent film forming ability, and which has a low dielectric constant and a low dielectric loss tangent, and the present invention relates to a random copolymer compound of (A) a polyphenylene ether resin having phenolic hydroxyl groups at both terminal ends thereof, (B) an aliphatic polymer having alcoholic hydroxyl groups at both terminal ends thereof, and (C) a binding agent, wherein the number of moles a of the polyphenylene ether resin (A), the number of moles b of the aliphatic polymer (B), and the number of mole c of the binding agent (C) satisfy the relationship (a + b) > c. |