| abstract |
A method for manufacturing an electronic device according to the present invention is a method for manufacturing an electronic device provided with a substrate having, formed on the surface thereof, a metal-exposed part and an electronic component provided on the substrate, the method comprising a flux treatment step of bringing the metal-exposed part into contact with a flux to treat the metal-exposed part with the flux and an introduction step of introducing a resin composition so as to allow the resin composition to contact with the surface of the flux-treated metal-exposed part, wherein the flux contains rosin, an activating agent and a solvent, the content of rosin is 1 to 18 parts by mass inclusive relative to 100 parts by mass of the flux, the ratio of change in mass of the flux before and after a heat treatment of the flux is 21% by mass or less, the resin composition contains an epoxy resin and a phenolic resin curing agent, and SP1 and Mn1 meet the requirement represented by the formula: Mn1 ≤ 210×SP1-4095 in the resin composition wherein SP1 represents the average solubility parameter of a resin group consisting of the epoxy resin and the phenolic resin curing agent as determined in accordance with a Hansen method and Mn1 represents the number average molecular weight of the resin group. |