| abstract |
A 3D printing method for a circuit board, comprising: using a 3D printer to print and curing a first insulating layer (1) on a substrate (1), the thickness of the first insulating layer (1) being greater than or equal to 10μm, and the first insulating layer (1) having a first wiring groove (20) corresponding to a first wiring pattern (21); using the 3D printer to print a liquid conductive medium to fill the first wiring groove (20) and cure the liquid conductive medium, and after being cured, the liquid conductive medium forming the first wiring pattern (21). Such 3D printing method for a circuit board may print to form a wiring pattern having a thickness greater than or equal to 10μm, increasing the thickness of the printed wiring, and reducing the wiring resistance. |