| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-18 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B33Y50-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B33Y10-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06F9-3004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01B9-02049
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C64-393
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C64-112 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C64-106
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C64-393
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B33Y50-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B33Y80-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-485
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C64-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 |
| filingDate |
2019-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_08a2e6b701ecd58bd5e9b0cc3ddce316
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_31c971de54ab8eb8b21d7a765a2a3abe
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fbed42c249a7603ed024e4711f5aad1b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9fdbb7f4c9fa4e9eb7f314666e1d0199 |
| publicationDate |
2019-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2019190676-A1 |
| titleOfInvention |
Integrating 3d printing into multi-process fabrication schemes |
| abstract |
Embodiments disclosed herein provide methods of forming bond pad redistribution layers (RDLs) in a fan-out wafer level packaging (FOWLP) scheme using an additive manufacturing process. In one embodiment, a method of forming a redistribution layer includes positioning a carrier substrate on a manufacturing support of an additive manufacturing system, the carrier substrate including a plurality of singulated devices, detecting one or more fiducial features corresponding to each of the plurality of singulated devices, determining actual positions of each of the plurality of singulated devices relative to one or more components of the additive manufacturing system, generating printing instructions for forming a patterned dielectric layer based on the actual positions of each of the plurality of singulated devices, and forming the patterned dielectric layer using the printing instructions. |
| priorityDate |
2018-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |