| abstract |
A resin material is provided which can 1) reduce the dielectric loss tangent of a cured product, 2) increase thermal dimensional stability of the cured product, 3) increase adhesion between an insulation layer and a metal layer, 4) reduce the post-etching surface roughness, and 5) increase the plated peel strength. The resin material contains: at least a compound A, which is a bismaleimide compound having a skeleton derived from dimer diamines and having a skeleton derived from a diamine compound other than dimer diamines, and/or a benzoxazine compound having a skeleton derived from dimer diamines and having a skeleton derived from a diamine compound other than dimer diamines; and an inorganic filler material. |