Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_78ca80ad4b743c901ec136b21263f093 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-385 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-382 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-2241 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-001 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-035 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2207-066 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-2224 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0158 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-024 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L25-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L25-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J3-203 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L71-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L71-123 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K5-14 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-013 |
filingDate |
2019-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f6f426bd59ba399af046e6900db7eeae http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_999e27c727a94f79a4d2cae4c97fc14d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2ead9339d59f5aa9277f3d057b0ae51c |
publicationDate |
2019-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
WO-2019186400-A1 |
titleOfInvention |
Thermally conductive thermoplastic compositions with good dielectric property and the shaped article therefore |
abstract |
A polymer composition includes: from about 20 wt. % to about 80 wt. % of a polymer base resin; from about 10 wt. % to about 60 wt. % of a thermally conductive filler; and from about 5 wt. % to about 60 wt. % of a dielectric ceramic filler having a Dk of at least 20 when measured at 1.1 GHz or greater. The polymer composition exhibits a dielectric constant greater than 3.0 at 1.1 GHz when tested using a split post dielectric resonator and network analyzer on a sample size of 120 mm by 120 mm and 6 mm thickness according to ASTM D150. The polymer composition exhibits a dissipation factor of less than 0.002 at 1.1 GHz when tested using a split post dielectric resonator and network analyzer on a sample size of 120 mm by 120 mm and 6 mm thickness according to ASTM D150. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110791096-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110791096-A |
priorityDate |
2018-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |